Electronica 2026 – Adhesive tapes and technical foams for the clectronics industry

From 10 to 13 November 2026, Munich will host electronica, the leading international trade fair and conference for the electronics industry.

Pladent will be participating alongside other Slovenian companies, presenting our expertise and solutions in adhesive tape converting, foam processing and the production of custom-engineered components at the Slovenian group stand.

Find us in Hall A6, booth 311. We look forward to meeting you!

Electronica brings together companies, experts and innovators from across the electronics, automotive, measurement and sensor technology industries, as well as many other sectors. Key topics at this year’s event include artificial intelligence, cyber resilience and energy efficiency. Learn more about electronica 2026.

Adhesive tapes for electronics

Adhesive tapes enable thin, clean and efficient bonding of different materials without mechanical fasteners. Depending on the application requirements, we help customers select the right adhesive tape for:

• Display and housing bonding – thin, reliable bonding and component attachment.
• Bonding to challenging surfaces – solutions for selected low-surface-energy plastics, metals, glass and other substrates.
• PCB masking – protecting specific areas during individual manufacturing processes.
• Electrical and thermal management – specialised materials for applications requiring specific electrical or thermal properties.
• Surface protection – protective tapes and films that help reduce the risk of damage during manufacturing, transport and assembly.

Technical foams for sealing, insulation and vibration damping

Foam materials play an important role in many electronic assemblies. Depending on the design and operating conditions, the right foam can provide:

• Housing sealing against dust and moisture, where the selected material and design meet the required level of protection.
• Vibration and noise damping in devices, housings and mechanical assemblies.
• Protection of electronic components against impact and mechanical stress.
• Gap filling and tolerance compensation between different components.
• Thermal insulation in applications where limiting heat transfer is important.

Custom Die-Cut and Kiss-Cut components

Standard materials are often just the starting point. Efficient integration also depends on the precise shape, dimensions and installation method of each component. Using a range of converting processes, we manufacture custom components from adhesive tapes, foams and other technical materials, including:

• Die-cut and kiss-cut components made from adhesive tapes, foams and other technical materials.
• Foam seals and spacers.
• Protective elements and functional pads.
• Laminated multilayer components.
• Technical parts for assembly, sealing and protection.

By adapting the material, shape and manufacturing process to the application, we help simplify assembly, ensure product consistency and meet the requirements of serial production.

Looking for materials or components for electronic devices?

Whether you need double-sided adhesive tape for display mounting, a foam gasket for an enclosure or a precision-cut component for serial production, we can help you find the right solution.